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Grand Innosys Ground Breaking Ceremony

27 May 2024

GRAND INNOSYS GROUND BREAKING CEREMONY

PERINDUSTRIAN TAMAN TASIK UTAMA, May 27, 2024

On May 27, 2024, Grand Innosys Malaysia Sdn Bhd proudly announced the grand opening of its state-of-the-art manufacturing facility in Perindustrian Taman Tasik Utama, Melaka. This strategic initiative represents a significant milestone in Grand Innosys’ pursuit of excellence and growth within the semiconductor industry. During the grand opening ceremony, YB Datuk Khaidhirah Binti Datuk Seri Abu Zahar remarked, “With an initial investment of RM 2.5 million, this new production site spans a land area of 0.1722 acres and will create up to 30 highly skilled local jobs by this year, 2024. The facility boasts an annual manufacturing capacity of 100 units of integrated circuit (IC) test equipment. This new development enhances their ability to provide high-quality service and reliability, supporting customers not only in Melaka but throughout Malaysia.”

The grand opening ceremony was honored by the presence of the Deputy EXCO for Investment, Industry, and TVET Development, YB Datuk Khaidhirah Binti Datuk Seri Abu Zahar; representative of the Chief Minister of Melaka, Exco for Youth Development, Sports, and NGO, YB Tuan P. Shanmugam A/L V. Pitchay; Melaka Investment Advisor and Affairs of the State for China, YB Datuk Lim Ban Hong; Managing Director of Grand Innosys (Malaysia), Mr. Chiang Hock; and Chairman & CEO of Grand Group, Mr. Wade Lam Yee Lung.

Mr. Chiang Hock, Managing Director of Grand Innosys (Malaysia), stated, “Grand Innosys selected Melaka for its new factory based on three critical factors: proximity to key customers, the region’s mature and well-established infrastructure supporting semiconductor backend manufacturing, and the competitive labor and facility costs in Malaysia. The initial investment strategy focuses on swiftly initiating the final assembly and testing of Semiconductor Pick and Place Handler systems for our key customer, Cohu. Over the next three to five years, Grand Innosys plans to expand vertical integration to include front-end manufacturing processes of sub-assemblies and machining processes, eventually encompassing the manufacturing of additional systems for a broader customer base.”

Grand Innosys specializes in the R&D, production, and sales of integrated circuit (IC) testing equipment. Over the past 17 years, it has established a strong foothold in the semiconductor equipment industry, serving local customers in Malaysia such as Infineon, Texas Instruments, Cohu, Osram, Unisem, and Carsem.

Prepared by Invest Melaka.

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